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In adhesion applications where incomparable resistance to impact and to thermal shock is of the utmost importance HD3561is unrivalled. This undiluted epoxy has a low viscosity and is used to bond neoprene, vinyl and other lead materials. HD3561 eliminates microscopic crack on the flexing of leads and is therefore very popular when potting where rigid or flexible wire protrude directly from the encapsulations. In addition, the system offers superior thermal conductivity.